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Effects of stress ratio on fatigue crack propagation properties of submicron-thick free-standing copper films

Kondo, Toshiyuki Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan kondo@micro.mech.eng.osaka-u.ac.jp; Hirakata, Hiroyuki Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan; Sakihara, Masayuki Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan; Minoshima, Kohji Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan; Imaoka, Takahiro Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan (2015-01-23)

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Author
- Hirakata, Hiroyuki Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan (1)
- Imaoka, Takahiro Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan (1)
- Kondo, Toshiyuki Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan kondo@micro.mech.eng.osaka-u.ac.jp (1)
- Minoshima, Kohji Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan (1)
- Sakihara, Masayuki Department of Mechanical Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan (1)
Subject
- Copper (1)
- Crack propagation (1)
- Fatigue (1)
- Stress ratio (1)
- Thin films (1)
- ... View More
Date Issued
- 2015 (1)