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Spatial and RF power dependence of the structural and electrical characteristics of copper zinc tin selenide thin films prepared by single elementary target sputtering

Jo, Yeon Hwa Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea; Jang, Jin Woo Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea; Cho, Yong Soo Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea ycho@yonsei.ac.kr (2015-01-26)
Characteristics of Cu 2 ZnSnSe 4 and Cu 2 ZnSn(Se,S) 4 absorber thin films prepared by post selenization and sequential sulfurization of co-evaporated Cu–Zn–Sn precursors

Lee, Seung Min Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea; Cho, Yong Soo Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea ycho@yonsei.ac.kr (2015-01-20)
Sputter-deposited low loss Mg 2 SiO 4 thin films for multilayer hybrids

Han, Chan Su Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea; Mohanty, Bhaskar Chandra Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea; Kang, Chong Yun Thin Film Materials Research Center, Korea Institute of Science and Technology, Seoul 130-659, Republic of Korea; Cho, Yong Soo Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea ycho@yonsei.ac.kr (2015-01-10)
Enhanced dielectric and tunable characteristics of K-doped Ba 0.5 Sr 0.5 TiO 3 thin films prepared by pulsed laser deposition

Sekhar, Koppole C. Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea; Hong, Kyung Pyo Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea; Key, Sung Hun Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea; Han, Chan Su Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea; Kim, Jun Chul Packaging Research Center, Korea Electronics Technology Institute, Gyeonggi-do 463-816, Republic of Korea; Park, Jong Chul Packaging Research Center, Korea Electronics Technology Institute, Gyeonggi-do 463-816, Republic of Korea; Kim, Dong Soo Packaging Research Center, Korea Electronics Technology Institute, Gyeonggi-do 463-816, Republic of Korea; Cho, Yong Soo Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea ycho@yonsei.ac.kr (2015-01-10)

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